Windows 10: Toshiba announces new small XFMEXPRESS NVMe SSD memory form factor

Source: Toshiba Memory Unveils New Technology for Removable NVMe Memory Devices with Groundbreaking Size to Performance Ratio | TOSHIBA MEMORY | Americas

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Intel Delivers New SSD Form Factor and Innovative Designs

Source: Intel Further Delivers on Storage Transformation with New SSD Form Factor and Innovative Designs | Intel Newsroom

 

Toshiba Unveils RC100 Series M.2 NVMe SSDs

Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, will be highlighting the use of its industry-leading BiCS FLASH 3D memory in several applications - including its new lineup of NVMe SSDs, the RC100 Series.

At CES, TMA is collaborating with its customers and technology partners to take on the future - together. Toshiba was the first company in the world[1] to announce 3D flash memory technology, which effectively addresses the processing, storage and management of the growing volume of data generated worldwide. Recent announcements see the company continuing to lead the industry forward, including the introduction of a 96-layer 512Gb die; the debut of the industry's first[2] flash memory device with quadruple-level cell (QLC) technology; and the addition of Through Silicon Via (TSV) technology. Already enabling the enterprise, data center, PC and mobile applications of today, TMA's BiCS FLASH has paved the way for the applications of tomorrow. In everything from artificial intelligence and virtual reality to a growing number of automotive applications (such as infotainment), high performance computing and the ever-expanding "internet of things," storage density needs will climb higher and higher - and BiCS FLASH was designed with this in mind.







CES - the biggest stage for consumer technology breakthroughs - is the ideal forum for the inventor of NAND flash to introduce its latest innovations. Harnessing the power of its state-of-the-art 64-layer BiCS FLASH 3D memory, TMA's latest SSD innovation sits right in the sweet spot between SATA SSDs and higher-end NVMe SSDs. The new RC100 Series was designed to address the entire spectrum of computing - and make the benefits of NVMe accessible to the mainstream market.

NVMe for Everyone
Making its debut at CES, TMA's RC100 M.2 NVMe SSD Series has been built from the ground up to deliver faster-than-SATA performance in a cost-effective and power-optimized solution for today's DIY builders and PC gamers. A small 22x42mm form factor, low power consumption, excellent performance and an affordable price all give the RC100 a true competitive edge.

Also at CES, the TMA Storage Group will demonstrate its small, sleek, ruggedized external SSD. The new XS700 incorporates Toshiba's BiCS FLASH technology and was designed with portability and affordability in mind.

 

Marvell Announces DRAM-less NVMe SSD Controller

Marvell, a worldwide leader in providing complete silicon solutions from mobile communications to storage, Internet of Things (IoT), cloud infrastructure, digital entertainment and in-home content delivery and Kinoma software enabling the "Smart Life and Smart Lifestyle," today announced the world's first DRAM-less NVMe (Non-Volatile Memory Express) solid state drive (SSD) controller for mass market mobile computing solutions with industry-leading NANDEdge low-density parity check (LDPC) technology supporting triple-level cell (TLC) and 3D NAND. Marvell's 88NV1140 and 88NV1120 enable small form factor SSD solutions with unparalleled performance for integration into low-z-height tablets, Chrome devices and the upcoming wave of new 2-in-1 hybrid/detachable mobile PC platforms.

"As mobile computing and cloud-based services become an integral part of our daily lives, fast, secure, reliable and cost effective storage solutions with a small form factor are the key to bringing the benefit of technology to the mass market. I believe our latest game-changing SSD controller will drive the fast deployment of a new wave of small form factor SSD solutions for the mass market mobile computing platforms," said Weili Dai, President and Co-Founder of Marvell. "I am very pleased to see Marvell's leadership and our long track record of invention and innovation including the world's first DRAM-less NVMe SSD controller and the industry's most advanced LDPC technology enabling the latest TLC and 3D NAND flash memory. I am very thankful for our global engineering teams who continuously raise the technology bar to move our industry forward faster."

The small form factor of Marvell's 88NV1140 and 88NV1120 at just 8x8mm per package allows SSD drives as small as M.2 2230 (30 mm in length). In addition, the new, leading-edge controllers can enable the development of an NVMe BGA or SATA BGA SSD running on embedded SRAM through multiple-chip-package (MCP) integration with NAND. Utilizing 28 nm low-power CMOS process node technology, the 88NV1140 and 88NV1120 controllers are best-in-class in active power while supporting all low power modes (L1.2 for PCIe and DevSlp for SATA devices). Both new solutions share Marvell's third-generation NANDEdge error-correction technology, as with the previously announced 88SS1093 PCIe Gen3x4 NVMe and 88SS1074 SATA SSD controllers. By developing single code for NANDEdge, SSD firmware developers are able to rapidly leverage one code to the other for the most advanced error-correcting technology for data integrity, endurance and reliability. In addition, Marvell's NANDEdge LDPC technology can support 15/16nm TLC and 3D NAND, resulting in low enabling cost of TLC and 3D NAND. The NVMe design has passed in-house SSD validation and third-party operating system and platform compatibility testing.

Key features of Marvell's new 88NV1140 and 88NV1120 include:

• 88NV1140: AHCI and NVMe support over PCIe Gen3x1
  o Fully hardware automated NVMe 1.1b support
  o Low power management (L1.2) design
• 88NV1120: SATA 6Gb/s support
  o SATA DevSlp support
• 88NV1140 and 88NV1120 both share:
  o Powerful Dual core Cortex R5 CPU's
  o Embedded SRAM with hardware accelerators to optimize IOPS performance
  o ONFI3 and Toggle2 NAND support
  o NANDEdge error-correction: 15nm TLC and 3D NAND support using LDPC technology to boost endurance and reliability
  o BGA SSD and M.2/2.5 slim form factor support with thermal optimization and small package size
  o 28 nm low power CMOS process