Windows 10: Intel Innovations Define the Future of Supercomputing

Discus and support Intel Innovations Define the Future of Supercomputing in Windows 10 News to solve the problem; What’s New: This week at Supercomputing 2018, Intel displays how its industry-leading technologies in the areas of computing, memory and interconnects... Discussion in 'Windows 10 News' started by Brink, Nov 12, 2018.

  1. Brink Win User

    Intel Innovations Define the Future of Supercomputing


    Source: Intel Innovations Define the Future of Supercomputing | Intel Newsroom

    :)
     
    Brink, Nov 12, 2018
    #1
  2. malware Win User

    Cray and Intel Collaborate to Develop Future Supercomputing Technologies

    Cray Inc. and Intel Corporation announced today they signed a multi-year agreement to advance high-performance computing (HPC) on Intel microprocessors while delivering broad new Intel and Cray technologies in future Cray server systems. The collaboration of these two industry leaders will result in HPC systems that will help solve some of the world's most complex scientific, engineering and humanitarian challenges.


    Intel Innovations Define the Future of Supercomputing Cray_announcement1_thm.jpg



    "We're excited at the potential of bringing together Intel's powerful silicon expertise and Cray's industry leadership in scalable HPC systems," said Peter Ungaro, president and CEO of Cray. "We pride ourselves in offering the most innovative supercomputing systems and our customers will now enjoy greater choice in processor technologies.

    "This collaboration provides the HPC market segment with access to the best microprocessors the industry has to offer at any point in time, in the most advanced supercomputers in the world," Ungaro added. "This further strengthens Cray's industry-leading adaptive supercomputing vision as we move into the Cascade timeframe and beyond."

    The two companies plan to explore future supercomputer component designs such as multi-core processing and advanced interconnects. As a result of this collaboration, Cray and Intel plan to develop a range of HPC systems and technologies over the next several years.

    "Cray's commitment to Intel is a testament of our commitment to HPC and the strength of our hardware and software roadmap and many-core research," said Patrick Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group. "Throughout Cray's history, it has been an innovator in high-end HPC while Intel has pushed the boundaries of processor technology.

    "The combination of this industry leadership and technical strength will allow HPC users to take advantage of future Xeon and other Intel processor technologies," Gelsinger said. "Together we will enable fundamental and historical problems of science and industry to be solved."

    Source: Intel
     
    malware, Nov 12, 2018
    #2
  3. btarunr Win User
    Intel Readies P55 Chipset B3 Stepping Update

    Intel's is readying a hardware update for its P55 Express chipset, currently the only core-logic for the company's brand new socket LGA-1156 processor platform. The new B3 stepping of the P55 PCH will bring with it a little more than new MM number and S-spec numbers. A list of changes is as follows:
    • New MM number and S-spec numbers for the converted products;
    • Firmware and minor BIOS updates are required with the conversion;
    • Processor MRC/microcode update required to enable future processors;
    • Recommended storage driver upgrade from Intel MSM 8.9 to Intel RST 9.5.
    Although it is listed that the MRC update enables 'future processors', Intel, in a statement issued to X-bit labs assured that the current B2 stepping of the chipset (found on current socket LGA-1156 motherboards) does not leave out support for any of Intel's new LGA-1156 processors that are slated for release in the very near future. The dual-core "Clarkale" 32 nm processor will be supported by both B2 and B3 steppings of the chipset.

    P55 B3 stepping is pin-identical to P55 B2, and hence motherboard vendors will not have to come up with new designs. Sampling of the new stepping began as early as on October 02, 2009, and it is scheduled for shipment to manufacturers by the 7th of December, 2009. P55 is the performance core-logic for the LGA-1156 platform. It supports Core i5 and Core i7 "Lynnfield" processors with discrete graphics.

    Source: X-bit labs
     
    btarunr, Nov 12, 2018
    #3
  4. Intel Innovations Define the Future of Supercomputing

    75% of TOP 500 Supercomputers Now Intel-based

    For a total NUTKICK to Intel, you can look at the statistics another way:

    Intel is the main processor "in" 75% of the top 500 supercomputers.
    But it represents only 39% of the PROCESSORS in use.
    And represents only 50% of the supercomputing POWER as represented by Rmax.

    Statistics. Dangerous things.

    The POWER LIST is represented by "Rmax share / Processor share" and shown in green in the table below:

    PowerPC450
    Opteron Quad Core
    PowerXCell 8i

    These are the 3 most powerful processors in the top 500. And they aint intel.


    Intel Innovations Define the Future of Supercomputing Capture089.png
     
    lemonadesoda, Nov 12, 2018
    #4
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Intel Innovations Define the Future of Supercomputing

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