Windows 10: Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

Brink · Jul 9, 2019

What’s New: This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology. When combined with Intel’s world-class process technologies, new packaging capabilities will unlock customer innovations and deliver the computing systems of tomorrow.
“Our vision is to develop leadership technology to connect chips and chiplets in a package to match the functionality of a monolithic system-on-chip. A heterogeneous approach gives our chip architects unprecedented flexibility to mix and match IP blocks and process technologies with various memory and I/O elements in new device form factors. Intel’s vertically integrated structure provides an advantage in the era of heterogeneous integration, giving us an unmatched ability to co-optimize architecture, process and packaging to deliver leadership products.”
–Babak Sabi, Intel corporate vice president, Assembly and Test Technology Development
Why It’s Important: Chip packaging has always played a critical – if under-recognized – role in the electronics supply chain. As the physical interface between the processor and the motherboard, the package provides a landing zone for a chip’s electrical signals and power supply. As the electronics industry transitions to the data-centric era, advanced packaging will play a much larger role than it has in the past.

More than just the final step in the manufacturing process, packaging is becoming a catalyst for product innovation. Advanced packaging techniques allow integration of diverse computing engines across multiple process technologies with performance parameters similar to a single die, but with a platform scope that far exceeds the die-size limit of single-die integration. These technologies will improve product-level performance, power and area while enabling a complete rethinking of system architecture.

What are Intel’s Updates: Intel is a leader in advanced packaging technology, with current offerings spanning both 2D and 3D approaches. At SEMICON West, Intel unveiled three new technologies that will open a new dimension in product architecture:

Co-EMIB: Intel’s EMIB and Foveros technologies leverage high-density interconnects to enable high bandwidth at low power, with I/O density on par with or better than competitive approaches. The company’s new Co-EMIB technology enables the linkage of even more computing performance and capability together. Co-EMIB allows for the interconnection of two or more Foveros elements with essentially the performance of a single chip. And designers can also connect analog, memory and other tiles with very high bandwidth and at very low power.

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ODI: Intel’s new Omni-Directional Interconnect provides even greater flexibility for communication among chiplets in a package. The top chip can communicate horizontally with other chiplets, similar to EMIB. It can also communicate vertically with through-silicon vias (TSVs) in the base die below, similar to Foveros. And ODI leverages large vertical vias to allow power delivery to the top die directly from the package substrate. Much larger than traditional TSVs, the large vias have lower resistance, providing more robust power delivery simultaneously with higher bandwidth and lower latency enabled through stacking. At the same time, this approach reduces the number of TSVs required in the base die, freeing up more area for active transistors and optimizing die size.

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MDIO: Building upon its Advanced Interface Bus (AIB) PHY level interconnect, Intel disclosed a new die-to-die interface called MDIO. The technology enables a modular approach to system design with a library of chiplet intellectual property blocks. MDIO provides better power efficiency and more than double the pin speed and bandwidth density offered by AIB.

Collectively, these technologies are complementary tools in a powerful toolbox. When combined with Intel’s process technologies, they form the underlying color palette for the creativity of its chip architects – giving them the freedom to dream up new products.
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Source: Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox | Intel Newsroom

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Brink · Jul 9, 2019

Intel Delivers 17-Qubit Superconducting Chip with Advanced Packaging

Today, Intel announced the delivery of a 17-qubit superconducting test chip for quantum computing to QuTech, Intel’s quantum research partner in the Netherlands. The new chip was fabricated by Intel and features a unique design to achieve improved yield and performance.

The delivery of this chip demonstrates the fast progress Intel and QuTech are making in researching and developing a working quantum computing system. It also underscores the importance of material science and semiconductor manufacturing in realizing the promise of quantum computing.

Press Kit: Quantum Computing

Quantum computing, in essence, is the ultimate in parallel computing, with the potential to tackle problems conventional computers can’t handle. For example, quantum computers may simulate nature to advance research in chemistry, materials science and molecular modeling – like helping to create a new catalyst to sequester carbon dioxide, or create a room temperature superconductor or discover new drugs.

However, despite much experimental progress and speculation, there are inherent challenges to building viable, large-scale quantum systems that produce accurate outputs. Making qubits (the building blocks of quantum computing) uniform and stable is one such obstacle.

Qubits are tremendously fragile: Any noise or unintended observation of them can cause data loss. This fragility requires them to operate at about 20 millikelvin – 250 times colder than deep space. This extreme operating environment makes the packaging of qubits key to their performance and function. Intel’s Components Research Group (CR) in Oregon and Assembly Test and Technology Development (ATTD) teams in Arizona are pushing the limits of chip design and packaging technology to address quantum computing’s unique challenges.

About the size of a quarter (in a package about the size of a half-dollar coin), the new 17-qubit test chip’s improved design features include:

New architecture allowing improved reliability, thermal performance and reduced radio frequency (RF) interference between qubits.

A scalable interconnect scheme that allows for 10 to 100 times more signals into and out of the chip as compared to wirebonded chips.

Advanced processes, materials and designs that enable Intel’s packaging to scale for quantum integrated circuits, which are much larger than conventional silicon chips.

“Our quantum research has progressed to the point where our partner QuTech is simulating quantum algorithm workloads, and Intel is fabricating new qubit test chips on a regular basis in our leading-edge manufacturing facilities,” said Dr. Michael Mayberry, corporate vice president and managing director of Intel Labs. “Intel’s expertise in fabrication, control electronics and architecture sets us apart and will serve us well as we venture into new computing paradigms, from neuromorphic to quantum computing.”

Intel’s collaborative relationship with QuTech to accelerate advancements in quantum computing began in 2015. Since that time, the collaboration has achieved many milestones – from demonstrating key circuit blocks for an integrated cryogenic-CMOS control system to developing a spin qubit fabrication flow on Intel’s 300mm process technology and developing this unique packaging solution for superconducting qubits. Through this partnership, the time from design and fabrication to test has been greatly accelerated.

“With this test chip, we’ll focus on connecting, controlling and measuring multiple, entangled qubits towards an error correction scheme and a logical qubit,” said professor Leo DiCarlo of QuTech. “This work will allow us to uncover new insights in quantum computing that will shape the next stage of development.”

Advancing the Quantum Computing System

Intel and QuTech’s work in quantum computing goes beyond the development and testing of superconducting qubit devices. The collaboration spans the entire quantum system – or “stack” – from qubit devices to the hardware and software architecture required to control these devices as well as quantum applications. All of these elements are essential to advancing quantum computing from research to reality.

Also, unlike others, Intel is investigating multiple qubit types. These include the superconducting qubits incorporated into this newest test chip, and an alternative type called spin qubits in silicon. These spin qubits resemble a single electron transistor similar in many ways to conventional transistors and potentially able to be manufactured with comparable processes.

While quantum computers promise greater efficiency and performance to handle certain problems, they won’t replace the need for conventional computing or other emerging technologies like neuromorphic computing. We’ll need the technical advances that Moore’s law delivers in order to invent and scale these emerging technologies.

Intel is investing not only to invent new ways of computing, but also to advance the foundation of Moore’s Law, which makes this future possible.

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Source: Intel Delivers 17-Qubit Superconducting Chip with Advanced Packaging to QuTech | Intel Newsroom

btarunr · Jul 9, 2019

Intel E5200 Gets Updated, R0 Stepping Coming Up

Intel's Pentium Dual-Core E5200 processor is getting on course for a specifications update. The chip will feature in a new, improved Wolfdale-2M core, spec'd out as the R0 stepping, from its current M0 stepping. The new stepping is intended to add new instructions, power-management features, and bring about changes in the chip-package. A short list of known changes is as follows:

CPUID changed from 10677 to 1067A

Power State Indicator (PSI) support with Intel 4 series chipsets

New instructions - XSAVE and XRSTOR

New S-spec and MM numbers

New halide-free chip package

Due to the changed CPUID, users may require BIOS updates to detect the CPU. According to the company, E5200 R0 should be out by April 13.

Source: TechConnect Magazine

btarunr · Jul 9, 2019

Intel Delivers 17-qubit Superconducting Chip with Advanced Packaging to QuTech

Today, Intel announced the delivery of a 17-qubit superconducting test chip for quantum computing to QuTech, Intel's quantum research partner in the Netherlands. The new chip was fabricated by Intel and features a unique design to achieve improved yield and performance. The delivery of this chip demonstrates the fast progress Intel and QuTech are making in researching and developing a working quantum computing system. It also underscores the importance of material science and semiconductor manufacturing in realizing the promise of quantum computing.

Quantum computing, in essence, is the ultimate in parallel computing, with the potential to tackle problems conventional computers can't handle. For example, quantum computers may simulate nature to advance research in chemistry, materials science and molecular modeling - like helping to create a new catalyst to sequester carbon dioxide, or create a room temperature superconductor or discover new drugs. However, despite much experimental progress and speculation, there are inherent challenges to building viable, large-scale quantum systems that produce accurate outputs. Making qubits (the building blocks of quantum computing) uniform and stable is one such obstacle.

Qubits are tremendously fragile: Any noise or unintended observation of them can cause data loss. This fragility requires them to operate at about 20 millikelvin - 250 times colder than deep space. This extreme operating environment makes the packaging of qubits key to their performance and function. Intel's Components Research Group (CR) in Oregon and Assembly Test and Technology Development (ATTD) teams in Arizona are pushing the limits of chip design and packaging technology to address quantum computing's unique challenges.

About the size of a quarter (in a package about the size of a half-dollar coin), the new 17-qubit test chip's improved design features include:

New architecture allowing improved reliability, thermal performance and reduced radio frequency (RF) interference between qubits.

A scalable interconnect scheme that allows for 10 to 100 times more signals into and out of the chip as compared to wirebonded chips.

Advanced processes, materials and designs that enable Intel's packaging to scale for quantum integrated circuits, which are much larger than conventional silicon chips.

"Our quantum research has progressed to the point where our partner QuTech is simulating quantum algorithm workloads, and Intel is fabricating new qubit test chips on a regular basis in our leading-edge manufacturing facilities," said Dr. Michael Mayberry, corporate vice president and managing director of Intel Labs. "Intel's expertise in fabrication, control electronics and architecture sets us apart and will serve us well as we venture into new computing paradigms, from neuromorphic to quantum computing."

Intel's collaborative relationship with QuTech to accelerate advancements in quantum computing began in 2015. Since that time, the collaboration has achieved many milestones - from demonstrating key circuit blocks for an integrated cryogenic-CMOS control system to developing a spin qubit fabrication flow on Intel's 300mm process technology and developing this unique packaging solution for superconducting qubits. Through this partnership, the time from design and fabrication to test has been greatly accelerated.

"With this test chip, we'll focus on connecting, controlling and measuring multiple, entangled qubits towards an error correction scheme and a logical qubit," said professor Leo DiCarlo of QuTech. "This work will allow us to uncover new insights in quantum computing that will shape the next stage of development."

Advancing the Quantum Computing System
Intel and QuTech's work in quantum computing goes beyond the development and testing of superconducting qubit devices. The collaboration spans the entire quantum system - or "stack" - from qubit devices to the hardware and software architecture required to control these devices as well as quantum applications. All of these elements are essential to advancing quantum computing from research to reality.

Also, unlike others, Intel is investigating multiple qubit types. These include the superconducting qubits incorporated into this newest test chip, and an alternative type called spin qubits in silicon. These spin qubits resemble a single electron transistor similar in many ways to conventional transistors and potentially able to be manufactured with comparable processes.

While quantum computers promise greater efficiency and performance to handle certain problems, they won't replace the need for conventional computing or other emerging technologies like neuromorphic computing. We'll need the technical advances that Moore's law delivers in order to invent and scale these emerging technologies.

Intel is investing not only to invent new ways of computing, but also to advance the foundation of Moore's Law, which makes this future possible.

Windows 10: Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

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