Windows 10: New Intel Lakefield processors for dual screen and foldable devices

Brink · Jun 10, 2020

Whatâs New: Today, Intel launched IntelÂ® Coreâ¢ processors with IntelÂ® Hybrid Technology, code-named âLakefield.â Leveraging Intelâs Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.
âIntel Core processors with Intel Hybrid Technology are the touchstone of Intelâs vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intelâs deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.â
âChris Walker, Intel corporate vice president and general manager of Mobile Client Platforms
Why Theyâre Great for Innovative PC Form Factors: Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size1 and extended battery life, providing OEMs more flexibility in form factor design across single, dual and foldable screen devices while delivering the PC experiences people expect. They are also:

The first Intel Core processors shipping with attached package-on-package (PoP) memory, further reducing board size.

The first Intel Core processors to deliver as low as 2.5mW of standby SoC power â an up to 91% reduction compared to Y-series processors â for more time between charges.

The first Intel processors to feature native dual internal display pipes, making them ideally suited for foldable and dual-screen PCs.

When You Can Get It: Two announced designs powered by the Intel Core processors with Intel Hybrid Technology and co-engineered with Intel include the Lenovo ThinkPad X1 Fold, the first fully functional PC with a folding OLED display unveiled at CES 2020 and expected to ship this year, and the Intel-based Samsung Galaxy Book S expected in select markets starting in June.

In June 2020, Intel launches âLakefield,â Intel Core processors with Intel Hybrid Technology. The processor leverages Intelâs Foveros 3D packaging technology and featuring a hybrid CPU architecture. (Credit: Intel Corporation)

About Key Features & Capabilities: Intel Core i5 and i3 processors with Intel Hybrid Technology leverage a 10nm Sunny Cove core to take on more intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with 32- and 64-bit Windows applications, helping reach new heights for the thinnest and lightest designs.

Smallest package size, enabled by Foveros: With Foveros 3D stacking technology, processors achieve a dramatic reduction in package area â now only a miniscule 12x12x1 mm, approximately the size of a dime â by stacking two logic dies and two layers of DRAM in three dimensions, also eliminating the need for external memory.

Hardware-guided OS scheduling: Enabling real-time communication between the CPU and the OS scheduler to run the right apps on the right cores, the hybrid CPU architecture helps deliver up to 24% better performance per SOC power3 and up to 12% faster single-threaded integer compute-intensive application performance.

More than 2x throughput on Intel UHD for AI-enhanced workloads: Flexible GPU engine compute enables sustained, high-throughput inference applications â including AI-enhanced video stylization, analytics and image resolution upscaling.

Up to 1.7x better graphics performance: Gen11 graphics delivers seamless media and content creation on the go â the biggest leap in graphics for Intel processor-based 7-watt systems. Convert video clips up to 54% faster7, and with support for up to four external 4K displays, immerse in rich visuals for content creation and entertainment.

Gigabit connectivity: With support for IntelÂ® Wi-Fi 6 (Gig+) and Intel LTE solutions, experience seamless video conferencing and streaming online.

Processor Number Graphics Cores / Threads Graphics (EUs) Cache TDP Base Freq (GHz) Max Single Core Turbo (GHz) Max All Core Turbo (GHz) Graphics Max Freq (GHz) Memory i5-L16G7 Intel UHD Graphics 5/5 64 4MB 7W 1.4 3.0 1.8 Up to 0.5 LPDDR4X-4267 i3-L13G4 Intel UHD Graphics 5/5 48 4MB 7W 0.8 2.8 1.3 Up to 0.5 LPDDR4X-4267
More Context: Lakefield Press Kit | Lakefield Product Brief | Press Deck | Intel Images: Up Close with Lakefield
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Source: Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens | Intel Newsroom

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Brink · Jun 13, 2020

New Intel Lakefield processors for dual screen and foldable devices

What’s New: Today, Intel launched Intel® Core™ processors with Intel® Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.
“Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.”
–Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms
Why They’re Great for Innovative PC Form Factors: Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size1 and extended battery life, providing OEMs more flexibility in form factor design across single, dual and foldable screen devices while delivering the PC experiences people expect. They are also:

The first Intel Core processors shipping with attached package-on-package (PoP) memory, further reducing board size.

The first Intel Core processors to deliver as low as 2.5mW of standby SoC power – an up to 91% reduction compared to Y-series processors – for more time between charges.

The first Intel processors to feature native dual internal display pipes, making them ideally suited for foldable and dual-screen PCs.

When You Can Get It: Two announced designs powered by the Intel Core processors with Intel Hybrid Technology and co-engineered with Intel include the Lenovo ThinkPad X1 Fold, the first fully functional PC with a folding OLED display unveiled at CES 2020 and expected to ship this year, and the Intel-based Samsung Galaxy Book S expected in select markets starting in June.

In June 2020, Intel launches “Lakefield,” Intel Core processors with Intel Hybrid Technology. The processor leverages Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture. (Credit: Intel Corporation)

About Key Features & Capabilities: Intel Core i5 and i3 processors with Intel Hybrid Technology leverage a 10nm Sunny Cove core to take on more intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with 32- and 64-bit Windows applications, helping reach new heights for the thinnest and lightest designs.

Smallest package size, enabled by Foveros: With Foveros 3D stacking technology, processors achieve a dramatic reduction in package area – now only a miniscule 12x12x1 mm, approximately the size of a dime – by stacking two logic dies and two layers of DRAM in three dimensions, also eliminating the need for external memory.

Hardware-guided OS scheduling: Enabling real-time communication between the CPU and the OS scheduler to run the right apps on the right cores, the hybrid CPU architecture helps deliver up to 24% better performance per SOC power3 and up to 12% faster single-threaded integer compute-intensive application performance.

More than 2x throughput on Intel UHD for AI-enhanced workloads: Flexible GPU engine compute enables sustained, high-throughput inference applications – including AI-enhanced video stylization, analytics and image resolution upscaling.

Up to 1.7x better graphics performance: Gen11 graphics delivers seamless media and content creation on the go – the biggest leap in graphics for Intel processor-based 7-watt systems. Convert video clips up to 54% faster7, and with support for up to four external 4K displays, immerse in rich visuals for content creation and entertainment.

Gigabit connectivity: With support for Intel® Wi-Fi 6 (Gig+) and Intel LTE solutions, experience seamless video conferencing and streaming online.

[table][tr][td]Processor Number[/td] [td]Graphics[/td] [td]Cores / Threads[/td] [td]Graphics (EUs)[/td] [td]Cache[/td] [td]TDP[/td] [td]Base Freq (GHz)[/td] [td]Max Single Core Turbo (GHz)[/td] [td]Max All Core Turbo (GHz)[/td] [td]Graphics Max Freq (GHz)[/td] [td]Memory[/td] [/tr] [tr][td]i5-L16G7[/td] [td]Intel UHD Graphics[/td] [td]5/5[/td] [td]64[/td] [td]4MB[/td] [td]7W[/td] [td]1.4[/td] [td]3.0[/td] [td]1.8[/td] [td]Up to 0.5[/td] [td]LPDDR4X-4267[/td] [/tr] [tr][td]i3-L13G4[/td] [td]Intel UHD Graphics[/td] [td]5/5[/td] [td]48[/td] [td]4MB[/td] [td]7W[/td] [td]0.8[/td] [td]2.8[/td] [td]1.3[/td] [td]Up to 0.5[/td] [td]LPDDR4X-4267[/td] [/tr] [/table]

More Context: Lakefield Press Kit | Lakefield Product Brief | Press Deck | Intel Images: Up Close with Lakefield
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Source: Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens | Intel Newsroom

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btarunr · Jun 13, 2020

Intel Gives Core i3 and Core i5 Dual-Core Processors K0 Stepping Update

Intel is giving some existing 32 nm "Clarkdale" based Core i3 and Core i5 processors an update. The processors will transition to the new K0 stepping from the existing C2 stepping. The parts that will be made on the K0 silicon are Core i3 models 530 (new sSPEC: SLBX7), 540 (new sSPEC: SLBTD) and Core i5 models 650 (new sSPEC: SLBTJ), 660/661 (SLBTK/SLBTB), 670 (SLBTL). Newer and upcoming models such as the i3-550, i3-560, i5-665K, and i5-680 are already being built on the K0 stepping die. Motherboards will require a BIOS update to support the new K0 stepping processors.

The K0 stepping change includes the following highlights:

New S-spec and MM numbers for the converting products

Extended CPUID will change from 0x00020652 to 0x00020655

Host RevID will change from 0x12 to 0x18

K0 stepping package is pin compatible with C2 stepping package

Adds Processor Context ID (PCID) support

The revised older SKUs that are built on K0 stepping will be market-available by October 16.

exodusprime1337 · Jun 13, 2020

windows xp installation and dual core am

could someone please list the steps they follow to install windows with a dual core processor and windows xp service pack to. I'm reletively new to amd dual core and i feel i'm missing a step. All help will be appreciated. thanx

Windows 10: New Intel Lakefield processors for dual screen and foldable devices

New Intel Lakefield processors for dual screen and foldable devices

New Intel Lakefield processors for dual screen and foldable devices

New Intel Lakefield processors for dual screen and foldable devices

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